San Jose, Calif. — Systems-in-package may have a time-to-market advantage over systems-on-chip, but the lack of SiP design tool support could chip away at that edge, say both users and EDA tool ...
Parts 1 and 2 of this three-part series reviewed the basics and SiP package technology and detailed the design challenges specific to RF SiPs. In this final installment, the author outlines the steps ...
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